Senior/Staff Advanced Packaging Materials Engineer, Texas Institute for Electronics

Job Posting Title: Senior/Staff Advanced Packaging Materials Engineer, Texas Institute for Electronics ---- Hiring Department: Texas Institute for Electronics ---- Position Open To: All Applicants ---- Weekly Scheduled Hours: 40 ---- FLSA Status: To Be Determined at Offer ---- Earliest Start Date: Ongoing ---- Position Duration: Expected to Continue ---- Location: AUSTIN, TX ---- Job Details: General Notes About Us The  Texas Institute for Electronics (TIE)  is a University of Texas at Austin-supported semiconductor consortium of state and local government, pre-eminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth. Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing. With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Texas Institute for Electronics embodies the city’s innovative spirit. UT Austin, recognized by Forbes as one of America’s Best Large Employers , provides outstanding employee benefits and total rewards packages that include: Competitive health benefits (employee premiums covered at 100%, family premiums at 50%) Voluntary Vision, Dental, Life, and Disability insurance options Generous paid vacation, sick time, and holidays Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) Flexible spending account options for medical and childcare expenses Robust free training access through LinkedIn Learning plus professional conference opportunities Tuition assistance Expansive employee discount program including athletic tickets Free access to UT Austin's libraries and museums with staff ID card Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card For more details, please see Benefits | Human Resources and UT Austin Employee Experience | Human Resources  and UT Austin Employee Experience | Human Resources This position may be filled at the Senior Engineer level or higher depending on experience and qualifications. Purpose Responsible for developing new formulations and evaluating current materials used in our advanced packaging products. Work closely with process development and other related internal teams and external vendors to define and create material candidates and potential material-based solutions. Responsible for developing a comprehensive testing and characterization plan for internally developed and externally acquired materials. Responsibilities Drive material formulation, characterization, and process optimization through structured Design of Experiments (DOE), data analysis, and root-cause investigations. Design and execute experiments to evaluate material properties, process performance, reliability, and compatibility with advanced packaging technologies, including 2.5D/3D integration, heterogeneous and mixed material integration, and hybrid bonding. Lead material qualification and performance validation, and qualification of innovative material solutions for advanced semiconductor packaging applications. Collaborate with cross-functional teams, including process engineering, equipment development, manufacturing, and external partners, to integrate new materials into semiconductor packaging processes. Serve as a technical subject matter expert, engaging with customers, suppliers, and industry partners to translate technical requirements into material specifications, development roadmaps, and commercially viable solutions. Able to work in a team environment, mentor junior engineers / students and communicate effectively. Other duties as assigned. Required Qualifications Senior Engineer: Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline and two years of experience in semiconductor packaging industry or a closely related industry, or Master’s degree or higher in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline. Staff Engineer: Bachelor’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline and five years of experience in semiconductor packaging industry or a closely related industry, or Master’s degree in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline, and three years of experience in semiconductor packaging industry or a closely related industry, or Ph.D. higher in Polymer Science, Materials Science and Engineering, or a closely related Engineering discipline. For all levels: Experience in semiconductor packaging industry or a closely related industry. Prior hands-on experience in semiconductor packaging materials development, process integration, or related manufacturing technologies, with a solid understanding of industry requirements and technical challenges. Strong understanding of advanced semiconductor packaging architectures and technologies, including 2.5D/3D integration, heterogeneous integration, chiplets, wafer-