Product Engineer I - II or Sr. Product Engineer, Texas Institute for Electronics

Job Posting Title: Product Engineer I - II or Sr. Product Engineer, Texas Institute for Electronics ---- Hiring Department: Texas Institute for Electronics ---- Position Open To: All Applicants ---- Weekly Scheduled Hours: 40 ---- FLSA Status: Exempt from FLSA ---- Earliest Start Date: Immediately ---- Position Duration: Expected to Continue ---- Location: AUSTIN, TX ---- Job Details: About Us The Texas Institute for Electronics (TIE) is a public-private partnership of preeminent semiconductor systems and defense electronics companies, national labs, and academic institutions.  Our mission is to advance the state-of-the-art in critical semiconductor domains such as advanced packaging, and in the process to help restore U.S. leadership in semiconductor manufacturing. We are developing cutting-edge semiconductor manufacturing equipment and processes that will define future roadmaps of semiconductor logic, memory, heterogenous integration, chip cooling, etc.  We are seeking a number of motivated individuals to join our team and help us in achieving the above goals.  TIE is part of the Cockrell School of Engineering at The University of Texas at Austin (UT Austin), a global leader in technology innovation and engineering education for over a century. With 11 undergraduate and 13 graduate programs, over 20 research centers and a faculty community that boasts one of the highest number of National Academy of Engineering members among U.S. universities, Texas Engineering has launched some of the nation’s most accomplished leaders and pioneered world-changing solutions in virtually every industry, from space exploration to energy to health care. Situated in the heart of Austin — named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Cockrell School embodies the city’s innovative spirit. Major companies with Austin campuses, such as Dell, National Instruments, Apple, IBM, Samsung, Google, Tesla, and many others, continue to recruit Cockrell School students at a remarkable rate, launching thousands of successful careers and developing Texas Engineers into industry leaders. At UT Austin, we say “What starts here changes the world.”  As a member of the university community, you will be part of an organization that is internationally recognized for our academic programs and research. Your work will have meaning and make a difference not only in the lives of our faculty, staff, and students, but also those who are impacted by our first class academic and research programs. UT Austin, recognized by Forbes as one of America’s Best Large Employers , provides outstanding employee benefits and total rewards packages that include: Competitive health benefits (employee premiums covered at 100%, family premiums at 50%) Voluntary Vision, Dental, Life, and Disability insurance options Generous paid vacation, sick time, and holidays Teachers Retirement System of Texas, a defined benefit retirement plan, with 7.75% employer matching funds Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b) Flexible spending account options for medical and childcare expenses Robust free training access through LinkedIn Learning plus professional conference opportunities Tuition assistance Expansive employee discount program including athletic tickets. Free access to UT Austin's libraries and museums with staff ID card Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card General Notes Multiple vacancies available.  This position may be filled at a higher-level title, relative to the experience and qualifications of the selected candidate.  Applicants must be authorized to work in the United States on a full-time basis for any employer without sponsorship. Relocation assistance may be available. We are bringing advanced semiconductor 3DHI packaging/manufacturing back to the USA and looking for motivated individuals to join our team. Purpose Responsible for IC & Test Structure product validation and optimization of manufacturing & Design processes to improve 3DHI yield, performance, & reliability across a wide range of customer heterogenous materials and micro-systems.  Work closely with circuit/layout design, process integration, and TEST teams to define and create work flow solutions, and methodologies to ensure products produced at TIE have the highest possible performance, quality, & reliability. Responsibilities Product and test vehicle validation to specifications, development and optimization of manufacturing/test workflows, 2.5D/3D modeling accuracies, creation of BKM’s (Best Known Practices) to comprehend and optimize Power/Thermal/Mechanical/Signal Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems. Contribute to the design and development of 2.5D & 3D advanced packaging solutions for semiconductor devices. Develop and support TIE's 3D-ADK (Assembly Design Kit). Interpret fab metrology, defect, E-test yield, and evaluate silicon-to-simulation correlation accuracies to understand and quantify process variations and their impacts on performance, yield, and reliability. Drive corrective actions across cross-functional teams to fix and identify root-cause systematic yield and reliability issues. Perform Failure analysis on products manufactured at TIE Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements. Design and execute appropriate DOE’s Stay current with industry trends and emerging technologies in semiconductor packaging and design integration to drive innovation and continuous improvement. Define product DFT & DFM requirements and methodologies. Help with ATE Test plan definitions and requirements. Bench/lab validation and characterization of various IC solutions and test structures to und