Director Pathfinding Solutions - Integrated Materials Solutions

Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. What We Offer Salary: $176,000.00 - $242,000.00 Location: Albany,NY You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.  At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .  Role Summary  The Director, Pathfinding Solutions will serve as a deep technical leader and hands-on contributor who develops next-generation semiconductor process solutions spanning logic and memory device architectures. This individual will operate at the intersection of process engineering, device physics, and materials science — working across Applied's product Business Units to assemble and de-risk integrated pathfinding solutions for N+1, N+2 and beyond technology nodes.  This is a technically distinguished individual contributor role at the E5 / Director level. The ideal candidate is a recognized expert in advanced semiconductor process integration — someone who can independently conceive, develop, and demonstrate pathfinding solutions, engage credibly with customer technologists at senior levels, and influence Applied's product roadmaps through deep technical insights. This is not a traditional people management role; it is a technical leadership position that demands world-class expertise, creativity, and execution.  Key Responsibilities  Pathfinding Solution Development  Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and / or memory (DRAM 4F2, 3D DRAM, NAND) device architectures  Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing — connecting individual process steps into integrated module flows  Identify and de-risk critical process challenges for N+1 and N+2 (solving integration problems) technology nodes through systematic experimentation and DTCO (Design-Technology Co-Optimization) analysis  Translate customer device performance targets (e.g., contact resistance reduction, carrier mobility enhancement, low-k integration, high-selectivity etch) into actionable Applied process solutions  Cross-BU Technical Integration  Work across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated value  Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements  Collaborates with DTCO for integration-level analysis that connects individual process capabilities to device-level performance metrics (Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, NAND)  Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modules  Customer Technical Engagement  Engage directly with senior technologists at key customers (Samsung, Intel, TSMC, SK Hynix, Micron etc) as a credible technical peer — presenting data, discussing integration approaches, and aligning on pathfinding priorities  Lead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshops  Translate customer integration challenges into Applied-actionable development programs and demo plans  Support customer co-development engagements by providing deep process expertise and integration guidance  Technical Thought Leadership  Publish at premier conferences (IEDM, VLSI, ISSCC, IRPS) and in top journals to establish Applied's technical leadership in pathfinding  Build a strong patent portfolio in advanced process integration and pathfinding solutions  Contribute to Applied's internal technical community through seminars, reviews, and mentoring of junior engineers  Stay at the forefront of semiconductor technology trends — including device architecture evolution, new materials, and emerging integration challenges  Qualifications  Required  Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline  10+ years of experience in semiconductor process development, integration, or device engineering — with deep expertise in FEOL, MOL, or BEOL process technologies  Demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes  Strong publication record at top-tier semiconductor conferences (IEDM, VLSI, IRPS) and/or a significant patent portfolio  Experience engaging directly with customer technical teams at major semiconductor manufacturers (IDMs, foundries, memory makers)  Deep understanding of device physics, process-structure-property relationships, and DTCO principles  Ability to work effectively across organizational boundaries — coordinating with multiple BUs, product teams, and customer organizations  Exceptional analytical, problem-solving, and communication skills  Preferred  Experience collaborating with or working at a semiconductor equipment or materials company with exposure to multiple process technologies  Track record as a Distinguished Member