Capital Equipment Hardware engineer - Advanced Packaging

Who We Are Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology. What We Offer Salary: $124,000.00 - $171,000.00 Location: Santa Clara,CA You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.  At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits .  Position Summary Applied Materials is seeking a Global Product Support (GPS) Engineer( Capital Equipment Hardware engineer ) to support installation, startup, qualification, and ongoing operation of the Kinex™ Hybrid Bonding platform being deployed for the CTO advanced packaging development programs. The successful candidate will serve as the primary equipment support engineer responsible for bringing the system from installation through process readiness while coordinating closely with Facilities, BESI, Applied Materials product engineering teams, and CTO process development teams. This role combines hands-on equipment support, system integration, startup execution, facilities coordination, and vendor engagement. The engineer will play a key role in establishing Kinex as a strategic advanced packaging platform supporting die-to-wafer hybrid bonding, optical interconnect, and next-generation heterogeneous integration development. Key Responsibilities Installation & Startup Support Kinex installation activities from tool dock through release to engineering users Coordinate Tier 0, Tier 1 and Tier 2 startup activities Drive closure of installation punch-list items Support factory acceptance and site acceptance activities with vendors Develop recovery plans for installation and startup issues Facilities Integration Support Facility Data Sheet (FDS) development and updates Coordinate with Facilities, EHS and infrastructure teams Define and validate tool utility requirements Support hookup and qualification activities Equipment Support Perform troubleshooting of mechanical, electrical, automation, and process-related issues Develop preventative maintenance procedures Support uptime improvement efforts Analyze equipment performance and reliability trends Drive root cause investigations and corrective actions Vendor & Product Engineering Engagement Act as primary technical interface with BESI and Kinex product engineering teams Coordinate technical reviews, service activities, upgrades, and modifications Manage escalation of hardware and software issues Support implementation of engineering changes and new capabilities Advanced Packaging Development Support Support hybrid bonding process development activities Work closely with CTO process engineers and researchers Enable wafer-to-wafer and die-to-wafer bonding development Support new module integration and experimental hardware evaluations Minimum Qualifications BS in Mechanical Engineering, Electrical Engineering, Mechatronics, Systems Engineering or related engineering discipline 3–7 years of engineering experience in semiconductor equipment – new college graduates applications will NOT be considered Experience supporting semiconductor manufacturing or development equipment Strong troubleshooting and root-cause analysis skills Excellent verbal and written communication skills Ability to work across facilities, vendors, process engineering, and operations teams Preferred Qualifications Highly Desired Experience with advanced packaging equipment Experience with hybrid bonding, wafer bonding, die attach, packaging, or assembly systems Experience with wet clean processes and systems Equipment installation and startup experience Facilities hookup and utility integration experience Vendor management and supplier coordination experience Hands-on experience troubleshooting complex semiconductor equipment Preferred Knowledge of: Automated material handling systems Vacuum systems Plasma processing systems Wet processing equipment Metrology systems Experience generating or reviewing: Site prep / installation documentation Equipment specifications Startup plans Qualification procedures Bonus Qualifications Prior experience with BESI equipment Hybrid bonding process knowledge 300 mm equipment experience Project management experience Cleanroom construction or tool installation experience Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable. For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement. Applied Materials is an Equal Opportunity Employer. Qualified applicant